特点：
设备采用高精度影像和光学系统以及精密自动对位工作台，一体化的设计减少了多次搬运造成的污染和加工误差，提高了设备的精度和生产效率。
Equipment using high-precision imaging and optical systems and precision automatic alignment table, integrated design reduces pollution and machining errors caused by repeated handling, improve the accuracy and efficiency of the device.
用途：
适用于IC TO LCM的COG邦定：FPC TO LCD的FOG邦定一体化设备。
Suitable for IC TO LCM of COG bonding: FPC TO LCD of FOG bonding equipment integration.
